Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
NOVEL (METH)ACRYLAMIDE POLYMER, RESIN COMPOSITION CONTAINING SAME, AND MOLDED BODY THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/286714
Kind Code:
A1
Abstract:
The present invention provides: a polymer that has excellent heat resistance and dielectric properties, that can dissolve in an organic solvent at a high concentration, and that has excellent compatibility with other thermoplastic resins and thermosetting resins; a resin composition containing said polymer; and a molded body of said resin composition.　A polymer according to the present invention has repeating units derived from a polymerizable compound represented by the following formula (I) (in the formula, X1 and X2 each independently represent a C7-C20 alkyl group or a C7-C20 alkoxy group; n represents 0 or 1; Z1 and Z2 each independently represent a single bond or a C1-C3 alkylene group; X3 and X4 each independently represent an organic group or a halogeno group; n1 and n2 each independently represent an integer of 0-4; and Y represents a polymerizable functional group), and repeating units derived from a polymerizable compound represented by formula (II) (in the formula, R indicates a hydrogen atom or a methyl group; R1 to R4 each independently indicate any of a hydrogen atom, a C1-C6 alkyl group, and a C1-C6 alkoxy group; R5 to R8 each independently represent an organic group or a halogeno group; m1 to m4 each independently represent an integer of 0-4; and m represents 0 or 1).

More Like This:
JPH05320266ACRYLONITRILE POLYMER FOR CARBON FIBER
JP2002523533INDUSTRIAL APPLICABILITY: A hydrophilic polymer dispersion composition containing an inorganic flocculant used for wastewater treatment and a method for producing the same.
JP2016517341Chromatography membrane stable under a corrosion condition
Inventors:
YAMATE TAIKI (JP)
KAWANISHI TAKUYA (JP)
UEDA HIROKI (JP)
NAKAYAMA EMI (JP)
Application Number:
PCT/JP2022/027129
Publication Date:
January 19, 2023
Filing Date:
July 08, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NIPPON SODA CO (JP)
International Classes:
C08F220/56; C08F299/02; C08L33/26; C08L63/00
Domestic Patent References:
WO2020262423A12020-12-30
WO2018070079A12018-04-19
WO2018070079A12018-04-19
WO2020071456A12020-04-09
WO2014203511A12014-12-24
WO2021024679A12021-02-11
Foreign References:
JP2021116350A2021-08-10
JP2022058957A2022-04-12
JP2013040270A2013-02-28
JP2004277460A2004-10-07
JPH06192502A1994-07-12
JP2000514122A2000-10-24
JP2007302901A2007-11-22
Attorney, Agent or Firm:
HIROTA, Masanori (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: NOVEL POLYMER, RESIN COMPOSITION INCLUDING SAME, AND MOLDED BODY THEREOF

Next Patent: PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE