Title:
NOVEL POLYAMIC ACID, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2013/165211
Kind Code:
A1
Abstract:
The present invention relates to: a novel polyamic acid in which imidazole is introduced to polymer chains; a photosensitive resin composition containing the polyamic acid which can provide a photosensitive material satisfying the characteristics of excellent flexibility and low stiffness, and has excellent heat resistance and coating resistance; a dry film obtained from the photosensitive resin composition; and a circuit board including the dry film.
Inventors:
KIM JUNG-HAK (KR)
KYUNG YOU-JIN (KR)
KIM HEE-JUNG (KR)
LEE KWANG-JOO (KR)
KYUNG YOU-JIN (KR)
KIM HEE-JUNG (KR)
LEE KWANG-JOO (KR)
Application Number:
PCT/KR2013/003864
Publication Date:
November 07, 2013
Filing Date:
May 03, 2013
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08G73/10; C08G79/08; C08J5/18; G03F7/004
Foreign References:
| KR20010077251A | 2001-08-17 | |||
| KR20100040269A | 2010-04-19 | |||
| KR20110045779A | 2011-05-04 | |||
| KR20110023814A | 2011-03-08 | |||
| KR101010036B1 | 2011-01-21 | |||
| JP2004025610A | 2004-01-29 | |||
| US20110054124A1 | 2011-03-03 |
Attorney, Agent or Firm:
YOU ME PATENT AND LAW FIRM (649-10 Yoksam-dongKangnam-ku, Seoul 135-080, KR)
Download PDF: