NOVEL POLYAMIDEIMIDE HAVING LOW THERMAL EXPANSION COEFFICIENT

Title:

NOVEL POLYAMIDEIMIDE HAVING LOW THERMAL EXPANSION COEFFICIENT

Document Type and Number:

WIPO Patent Application WO/2014/104557

Kind Code:

A1

Abstract:

The present invention relates to a polyamideimide comprising an asymmetric dicarboxylic acid derivative wherein, from among a cyclic group A and a cyclic group B, two substituent groups R and R' are bonded only to the cyclic group A on one side. A polymer produced by means of the present invention can have adequate solubility with respect to organic solvents, high thermal stability, a high glass transition temperature, high transparency and a low thermal expansion coefficient, and is able not only to satisfy requirements for core substrate materials of flexible displays but also to be used as a material for various soft electronic data devices.

Inventors:

KIM SANG YOUL (KR)
KIM SUN DAL (KR)

Application Number:

PCT/KR2013/009763

Publication Date:

July 03, 2014

Filing Date:

October 31, 2013

Export Citation:

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Assignee:

KOREA ADVANCED INST SCI & TECH (KR)

International Classes:

C07D403/10; C07F1/00; C08G73/14

Foreign References:

JP2012077144A	2012-04-19
JP2010106225A	2010-05-13
JP2010106225A	2010-05-13
JP2012077144A	2012-04-19

Other References: