NOVEL POLYVALENT HYDROXY COMPOUND, METHOD FOR PRODUCING THE SAME, EPOXY RESIN USING THE COMPOUND, AND EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF

WIPO Patent Application WO/2008/117839

A1

Disclosed are a novel polyvalent hydroxy compound and an epoxy resin, each of which can be represented by the general formula (1) below. The resin is excellent in close adhesion to a material of a different kind, and enables to obtain a cured product having excellent flame retardancy and heat resistance. In the formula, A represents a benzene ring or naphthalene ring which may be substituted by a hydrocarbon group having 1-8 carbon atoms; R1 and R2 may be the same or different and represent a hydrogen atom or an alkyl group having 1-6 carbon atoms; G representsa hydrogen atom or a glycidyl group; n represents a number of 1-10; and m represents an integer of 1-2.

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YAMADA HISASHI (JP)
ASAKAGE HIDEYASU (JP)

PCT/JP2008/055798

October 02, 2008

March 19, 2008

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TOTO KASEI KK (JP)
YAMADA HISASHI (JP)
ASAKAGE HIDEYASU (JP)

C07C323/18; C07C319/20; C07D303/34; C08G59/62; H01L23/29; H01L23/31

JPH02185515A	1990-07-19
JP2002338541A	2002-11-27
JPH0959248A	1997-03-04

TANAKA, Hiroshi et al. (19-14 Toranomon 1-chom, Minato-ku Tokyo 01, JP)

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