NOVEL SURFACE-PACKAGED CAPACITOR AND FABRICATION METHOD FOR NOVEL SURFACE-PACKAGED CAPACITOR

WIPO Patent Application WO/2022/116927

A1

Provided in the present application are a novel surface-packaged capacitor and a fabrication method for the novel surface-packaged capacitor, the capacitor comprising: a first capacitor core, electronic components, a first substrate, an anode bottom surface terminal, a cathode bottom surface terminal, a first anode leading-out terminal and a first cathode leading-out terminal. In the embodiments of the present application, by means of providing a first anode connecting groove and a first cathode connecting groove on the first substrate, a path may be formed inside the novel surface-packaged capacitor, so that two-path parallel equivalent resistance is formed between internal components of the novel surface-packaged capacitor and the bottom surface terminals, thereby reducing an ESR value of the novel surface-packaged capacitor. In addition, by means of connecting electronic components in series internally, the overall voltage of the novel surface-packaged capacitor is increased, or on the basis of an original single-core structure, a functional circuit (electronic components) is added to improve the reliability of the novel surface-packaged capacitor.

NING LIANCAI (CN)
HUANG JIANYAO (CN)
YANG KAI (CN)

PCT/CN2021/133847

June 09, 2022

November 29, 2021

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CHINA ZHENHUA GROUP XINYUN ELECTRONIC COMP & DEV CO LTD STATE RUN FACTORY 4326 (CN)

H01G4/224; H01G4/228; H01G4/38; H01G4/40

JPH0817686A	1996-01-19
CN107026019A	2017-08-08
US20160268054A1	2016-09-15
CN109416384A	2019-03-01
CN110853920A	2020-02-28
CN110249400A	2019-09-17
KR20150072155A	2015-06-29
CN214175870U	2021-09-10
CN112435854A	2021-03-02

CHOFN INTELLECTUAL PROPERTY (CN)

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