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Title:
ONE-LIQUID-TYPE THERMOSETTING HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION, AND METHOD FOR PRODUCING CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/159309
Kind Code:
A1
Abstract:
Provided is a one-liquid-type thermosetting heat-conductive silicone grease composition which initially has low viscosity but high shape retention, which becomes soft after heat-curing, which has good adhesion to a substrate, and which can be stored at room temperature. Also provided is a method for producing a cured product of said composition. This one-liquid-type thermosetting heat-conductive silicone grease composition comprises, as essential components, (A) an alkenyl-group-containing organopolysiloxane having a viscosity at 25°C of 50-100,000 mPa·s, (B) a liquid organohydrogenpolysiloxane having a viscosity at 25°C of 100 mPa·s or less, having 2-10 Si-H groups and an alkoxy group and/or an epoxy group, having a degree of polymerization of 15 or less, and having a polysiloxane backbone including a cyclic structure, (C) a specific photoactive platinum complex curing catalyst, and (D) a heat-conductive filler having a heat conductivity of 10 W/m·°C or more, wherein the composition has a viscosity at 25°C of 30-800 Pa·s, as measured at a rotation speed of 10 rpm using a Malcom viscometer, and the composition can be stored at room temperature.

Inventors:
IWATA MITSUHIRO (JP)
Application Number:
PCT/JP2017/007418
Publication Date:
September 21, 2017
Filing Date:
February 27, 2017
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/07; C08K3/00; C08K5/549; C08L83/06; C09K5/14
Domestic Patent References:
WO2016076025A12016-05-19
WO2013070350A12013-05-16
WO2016047219A12016-03-31
Foreign References:
JP2012067153A2012-04-05
JP2008510030A2008-04-03
JP2010242087A2010-10-28
JPH08208993A1996-08-13
JPS61157569A1986-07-17
JP2004352947A2004-12-16
JPS543663B21979-02-26
JP4255287B22009-04-15
JP2003301189A2003-10-21
JP2009286855A2009-12-10
JP2002327116A2002-11-15
JP2013227374A2013-11-07
JP3865638B22007-01-10
Other References:
See also references of EP 3431553A4
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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