Title:
ONE-LIQUID-TYPE THERMOSETTING HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION, AND METHOD FOR PRODUCING CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/159309
Kind Code:
A1
Abstract:
Provided is a one-liquid-type thermosetting heat-conductive silicone grease composition which initially has low viscosity but high shape retention, which becomes soft after heat-curing, which has good adhesion to a substrate, and which can be stored at room temperature. Also provided is a method for producing a cured product of said composition. This one-liquid-type thermosetting heat-conductive silicone grease composition comprises, as essential components, (A) an alkenyl-group-containing organopolysiloxane having a viscosity at 25°C of 50-100,000 mPa·s, (B) a liquid organohydrogenpolysiloxane having a viscosity at 25°C of 100 mPa·s or less, having 2-10 Si-H groups and an alkoxy group and/or an epoxy group, having a degree of polymerization of 15 or less, and having a polysiloxane backbone including a cyclic structure, (C) a specific photoactive platinum complex curing catalyst, and (D) a heat-conductive filler having a heat conductivity of 10 W/m·°C or more, wherein the composition has a viscosity at 25°C of 30-800 Pa·s, as measured at a rotation speed of 10 rpm using a Malcom viscometer, and the composition can be stored at room temperature.
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Inventors:
IWATA MITSUHIRO (JP)
Application Number:
PCT/JP2017/007418
Publication Date:
September 21, 2017
Filing Date:
February 27, 2017
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/07; C08K3/00; C08K5/549; C08L83/06; C09K5/14
Domestic Patent References:
| WO2016076025A1 | 2016-05-19 | |||
| WO2013070350A1 | 2013-05-16 | |||
| WO2016047219A1 | 2016-03-31 |
Foreign References:
| JP2012067153A | 2012-04-05 | |||
| JP2008510030A | 2008-04-03 | |||
| JP2010242087A | 2010-10-28 | |||
| JPH08208993A | 1996-08-13 | |||
| JPS61157569A | 1986-07-17 | |||
| JP2004352947A | 2004-12-16 | |||
| JPS543663B2 | 1979-02-26 | |||
| JP4255287B2 | 2009-04-15 | |||
| JP2003301189A | 2003-10-21 | |||
| JP2009286855A | 2009-12-10 | |||
| JP2002327116A | 2002-11-15 | |||
| JP2013227374A | 2013-11-07 | |||
| JP3865638B2 | 2007-01-10 |
Other References:
See also references of EP 3431553A4
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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