Title:
ONE-PACK TYPE CURABLE RESIN COMPOSITION AND ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2022/114073
Kind Code:
A1
Abstract:
A one-pack type curable resin composition which contains 100 parts by weight of (A) an epoxy resin, from 1 to 100 parts by weight of (B) polymer particles having a core-shell structure and/or a blocked urethane, (C) a compound which has from 1 to 3 phenolic hydroxyl groups in each molecule (provided that a compound having an amino group is not considered as a compound (C)), and (D) dicyandiamide. The (number of moles of phenolic hydroxyl groups in compound (C))/(number of moles of CN groups generated from dicyandiamide (D)) ratio is from 0.01 to 0.39 in cases where the compound (C) has one phenolic hydroxyl group, while the ratio is from 0.01 to 1.5 in cases where the compound (C) has two or three phenolic hydroxyl groups.
Inventors:
OKAMOTO TOSHIHIKO
Application Number:
PCT/JP2021/043253
Publication Date:
June 02, 2022
Filing Date:
November 25, 2021
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
B32B27/38; B32B7/12; C08K5/13; C08K5/29; C08K5/31; C08L51/04; C08L51/06; C08L51/08; C08L63/00; C08L75/04; C09J11/06; C09J11/08; C09J163/00
Foreign References:
| JP2016199673A | 2016-12-01 | |||
| JP2005344046A | 2005-12-15 | |||
| JP2005036095A | 2005-02-10 | |||
| JP2001040069A | 2001-02-13 | |||
| JP2001214040A | 2001-08-07 |
Attorney, Agent or Firm:
ARCO PATENT & TRADEMARK ATTORNEYS (JP)
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