Title:
ONE-PACK TYPE EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/171572
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an epoxy resin composition which contains a reactive diluent that is capable of decreasing the viscosity of an epoxy resin with a minimum deterioration in the normal performance of the epoxy resin, while being capable of providing additional imparted effects such as adhesiveness and storage stability. The present invention provides a one-pack type epoxy resin composition which contains a compound represented by general formula (1) (component (A)), an epoxy resin (component (B)) and an amine-based curing agent (component (C)). In general formula (1), R1 represents a hydrogen atom or a methyl group; each of R2 and R3 independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms or an alkoxy group having 1 to 6 carbon atoms; and n represents an integer of 1 to 3.
Inventors:
MIWA TAKUYA (JP)
HASEGAWA YUI (JP)
TAMASO KEN-ICHI (JP)
HASEGAWA YUI (JP)
TAMASO KEN-ICHI (JP)
Application Number:
PCT/JP2023/008106
Publication Date:
September 14, 2023
Filing Date:
March 03, 2023
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C08G59/50; C09J11/06; C09J163/00
Foreign References:
| JP2014515045A | 2014-06-26 | |||
| JPH08165328A | 1996-06-25 | |||
| JPH05140265A | 1993-06-08 |
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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