Title:
ONLINE THICKNESS MEASUREMENT STRUCTURE FOR SEMICONDUCTOR CONDUCTIVE THIN FILM AND MEASUREMENT METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/268039
Kind Code:
A1
Abstract:
An online thickness measurement structure for a semiconductor conductive thin film. The structure comprises a four-probe resistance test bridge structure and a continuous step structure. According to the online measurement structure, random errors during a step manufacturing process are averaged by using a plurality of steps, and a numerical value of a resistance change is increased by using the plurality of steps, so as to facilitate measurement. Further provided is an online thickness measurement method for a semiconductor conductive thin film. The method is simple; the requirements of a measurement device are low; a measurement process and a measurement parameter value are stable; a machining process is synchronous with that of a micro-electromechanical device; there is no special machining requirement, and the requirement for online measurement is completely met; and a calculation method is only limited to a simple mathematical formula.
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Inventors:
ZHOU ZAIFA (CN)
SONG YUJIE (CN)
HUANG QINGAN (CN)
SONG YUJIE (CN)
HUANG QINGAN (CN)
Application Number:
PCT/CN2022/099950
Publication Date:
December 29, 2022
Filing Date:
June 20, 2022
Export Citation:
Assignee:
UNIV SOUTHEAST (CN)
International Classes:
G01B7/06
Domestic Patent References:
| WO1996029568A1 | 1996-09-26 |
Foreign References:
| CN113267118A | 2021-08-17 | |||
| CN112320754A | 2021-02-05 | |||
| CN102701146A | 2012-10-03 | |||
| TW202002009A | 2020-01-01 | |||
| JP2007285804A | 2007-11-01 |
Attorney, Agent or Firm:
NANJING RUIHONG PATENT & TRADEMARK AGENCY (ORDINARY PARTNERSHIP) (CN)
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