Title:
OPTICAL ELEMENT MOUNTING PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2020/080539
Kind Code:
A1
Abstract:
Provided are an optical element mounting package, an electronic device, and an electronic module, which are capable of reducing the influence of heat generated from an optical element to an optical component. This optical element mounting package (101) and this electronic device (100) include a base body (110) having a recess (111) including a first mounting section (113a) on which an optical element (102) can be mounted and a second mounting section (113b) on which an optical component (103) can be mounted. The base body (110) further has a heat radiating section (120) located on the opposite side of the second mounting section (113b) with the first mounting section (113a) therebetween.
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Inventors:
KITAGAWA AKIHIKO (JP)
YAMASAKI SHO (JP)
YAMASAKI SHO (JP)
Application Number:
PCT/JP2019/041184
Publication Date:
April 23, 2020
Filing Date:
October 18, 2019
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01S5/024; H01L23/28; H01L33/64
Foreign References:
| JP2005243744A | 2005-09-08 | |||
| JP2018117088A | 2018-07-26 | |||
| JP2013161841A | 2013-08-19 | |||
| JP2017098494A | 2017-06-01 | |||
| JP2006339559A | 2006-12-14 | |||
| JP2018101692A | 2018-06-28 | |||
| US20150121683A1 | 2015-05-07 | |||
| JPH06275920A | 1994-09-30 |
Other References:
See also references of EP 3869639A4
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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