OPTICAL FIBER MODULE AND MANUFACTURING METHOD THEREFOR

Title:

OPTICAL FIBER MODULE AND MANUFACTURING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2023/233474

Kind Code:

A1

Abstract:

This optical fiber module (10) is formed by optically connecting a planar light wave circuit (101) and an optical fiber (100), the optical fiber module being characterized in that: the planar light wave circuit (101) has formed on a substrate (102) an optical waveguide (103) which comprises a core (103a) and cladding (103b); a conductive thin film (105) is disposed on an inclined surface which is formed between an end surface of the substrate (102) connected to the optical fiber (100) and a rear surface of the substrate (102); and the optical fiber (100) is fusion-spliced to the planar light wave circuit (101).

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Inventors:

KATAYOSE SATOMI (JP)
SAKAMOTO JUNJI (JP)
FUJIWARA YUJI (JP)

Application Number:

PCT/JP2022/021962

Publication Date:

December 07, 2023

Filing Date:

May 30, 2022

Export Citation:

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Assignee:

NIPPON TELEGRAPH & TELEPHONE (JP)

International Classes:

G02B6/30; G02B6/13; G02B6/255

Foreign References:

JP2018004830A	2018-01-11
US5073002A	1991-12-17
JPH05134130A	1993-05-28
JPH05150133A	1993-06-18

Other References:

NAURIYAL JUNIYALI, SONG MEITING, YU RAYMOND, CARDENAS JAIME: "Fiber-to-chip fusion splicing for low-loss photonic packaging", OPTICA, THE OPTICAL SOCIETY, US, vol. 6, no. 5, 20 May 2019 (2019-05-20), US , pages 549, XP093115848, ISSN: 2334-2536, DOI: 10.1364/OPTICA.6.000549

Attorney, Agent or Firm:

TANI & ABE, P.C. (JP)

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