Title:
OPTICAL MICROSYSTEM AND METHOD FOR MAKING SAME
Document Type and Number:
WIPO Patent Application WO2004023166
Kind Code:
A3
Abstract:
The invention concerns the manufacture of optical microsystems for miniature cameras or miniature matrix displays. The method consists in collectively manufacturing, on the front surface of a semiconductor wafer, N matrix arrays of image points and associated circuits, to produce N identical chips (10), with on the side of each array external connection pads (CC); collectively manufacturing and placing in close contact with the front surface of the semiconductor wafer a plate (22) designed for the collective formation of N identical image-forming optical structures, each image-forming optical structure covering one respective chip (10) while being adapted to form an overall image corresponding to the matrix array assembly of the respective chip; boring through the thickness of the wafer conductive vias (32) reaching up to the contact pads; and only, following those various operations, dividing the wafer into N individual optical microsystems comprising an electronic chip covered with an optical structure.
Inventors:
ROMMEVEAUX PHILIPPE (FR)
Application Number:
PCT/FR2003/002629
Publication Date:
May 13, 2004
Filing Date:
September 02, 2003
Export Citation:
Assignee:
ATMEL GRENOBLE SA (FR)
ROMMEVEAUX PHILIPPE (FR)
ROMMEVEAUX PHILIPPE (FR)
International Classes:
(IPC1-7): H01L27/146
Foreign References:
| FR2829292A1 | 2003-03-07 | |||
| EP1122790A2 | 2001-08-08 | |||
| US4956687A | 1990-09-11 | |||
| EP1102321A2 | 2001-05-23 | |||
| US6051867A | 2000-04-18 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 011, no. 108 (E - 495) 4 April 1987 (1987-04-04)
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