Title:
OPTICAL MODULE HEAT DISSIPATION ASSEMBLY AND OPTICAL COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/236966
Kind Code:
A1
Abstract:
An optical module heat dissipation assembly and an optical communication device. The optical module heat dissipation assembly comprises at least two levels of optical modules (102a, 102b, 103a, 103b, 103c), a heat dissipation structure (1), a heat exchanger (2), and a drive pump (3); the at least two levels of optical modules (102a, 102b, 103a, 103b, 103c) are in a stacked arrangement, and a heat dissipation direction of the bottom level optical module (102b, 103a) faces away from an adjacent optical module (102a, 103b) located on a higher level; the heat dissipation structure (1) is in thermally conductive contact with one end of the bottom optical module (102b, 103a) in the heat dissipation direction; a refrigerant is stored in the heat exchanger (2); and the drive pump (3) is connected to the heat exchanger (2) and is used for controlling the refrigerant to circulate between the heat dissipation structure (1) and the heat exchanger (2). Consequently, continuous heat dissipation and cooling of the bottom optical module (102b, 103a) is achieved. By means of cooling by the flow of refrigerant, a smaller design of the overall size is achieved, fins do not need to be designed, installation is convenient, and the present invention has an excellent heat dissipation effect.
Inventors:
JIAO ZELONG (CN)
WANG XU (CN)
WANG XU (CN)
Application Number:
PCT/CN2023/098715
Publication Date:
December 14, 2023
Filing Date:
June 06, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G02B6/42; H05K7/20
Foreign References:
| CN110806620A | 2020-02-18 | |||
| CN106098657A | 2016-11-09 | |||
| CN113138446A | 2021-07-20 | |||
| US20200229321A1 | 2020-07-16 | |||
| CN110146956A | 2019-08-20 | |||
| CN204362490U | 2015-05-27 | |||
| US20190387650A1 | 2019-12-19 |
Attorney, Agent or Firm:
UNI-INTEL PATENT AND TRADEMARK LAW FIRM (CN)
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