OPTICAL MODULE HOUSING AND MANUFACTURING METHOD THEREFOR, AND OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE

WIPO Patent Application WO/2024/045737

A1

An optical module housing (11), comprising a housing body (110) and a clad layer (120), wherein the clad layer (120) is located on the surface of the housing body (110); and at least in a contact area (11a), the roughness Ra of the clad layer (120) does not exceed 0.6 μm, and the contact area (11a) is an area, which is used for coming into contact with a radiator (30), of the optical module housing (11). The roughness Ra of the clad layer (120) in the contact area (11a) is set to not exceed 0.6 μm, such that when an optical module (10) is connected to an optical module connector (20), a gap between the contact area (11a) of the optical module housing (11) and the radiator (30) is smaller, thereby reducing the contact thermal resistance, facilitating heat exchange between the optical module housing (11) and the radiator (30) and acceleration of the dissipation of heat from the optical module (10), and thus preventing the temperature of the optical module (10) from being too high. Further included are a manufacturing method for an optical module housing, and an optical module (10) and an optical communication device.

WEI XIAOYUN (CN)
YANG YONG (CN)
DENG CHAOJUN (CN)

PCT/CN2023/098230

March 07, 2024

June 05, 2023

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HUAWEI TECH CO LTD (CN)

G02B6/42; H05K7/20

CN216485667U	2022-05-10
JP2021139365A	2021-09-16
CN102612302A	2012-07-25
CN102656758A	2012-09-05
CN107369660A	2017-11-21
CN1836829A	2006-09-27
JP2008227395A	2008-09-25

BEIJING SAN GAO YONG XIN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)

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