Title:
OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2019/208055
Kind Code:
A1
Abstract:
The present invention reduces conduction failure due to the inclination in a BGA optical module with an optical fiber interface during reflow soldering. The optical module according to the present invention is provided with a ball grid array 102 as an electrical interface for mounting the optical module on a packaging substrate on one surface of a substrate 101 to which an optical fiber 105 is connected and secured and whereon an electronic circuit and an optical circuit or the like are formed. The other surface of the substrate 101 is provided with a thermally conductive lid 103 and a thermally conductive fiber routing mechanism 201 in contact with the lid, the fiber routing mechanism having a shape which allows the optical fiber to be wound therearound.
Inventors:
KIKUCHI KIYOFUMI (JP)
SOMA SHUNICHI (JP)
TSUZUKI KEN (JP)
ASAKAWA SHUICHIRO (JP)
SOMA SHUNICHI (JP)
TSUZUKI KEN (JP)
ASAKAWA SHUICHIRO (JP)
Application Number:
PCT/JP2019/012356
Publication Date:
October 31, 2019
Filing Date:
March 25, 2019
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE (JP)
International Classes:
G02B6/42; G02B6/46
Domestic Patent References:
| WO2017138468A1 | 2017-08-17 |
Foreign References:
| US20160124164A1 | 2016-05-05 | |||
| JP2004287184A | 2004-10-14 | |||
| JP2006059884A | 2006-03-02 | |||
| US20140064659A1 | 2014-03-06 |
Attorney, Agent or Firm:
TANI & ABE, P.C. (JP)
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