Title:
OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2022/110965
Kind Code:
A1
Abstract:
Provided is an optical module, comprising: a circuit board (300), a first optical fiber array (302), a second optical fiber array (303), a lithium niobate chip (500), and a silicon optical chip (400). The circuit board (300) is provided with a laser (301); a signal light emitted from the laser (301) enters a first optical core array (302) by way of the lithium niobate chip (500), performing a light emission function; the lithium niobate chip (500) contains a modulation unit; at the same time, by means of an optical coupling connection between the silicon optical chip (400) and the lithium niobate chip (500), monitoring of the modulated optical path is achieved. An optical transceiver device consists of a combination of a silicon optical chip (400) and a lithium niobate chip (500), achieving the modulation of an optical signal and monitoring of a modulated signal, making full use of the high bandwidth, low drive voltage, and low insertion loss of a lithium niobate modulator and the advantage of a high degree of integration of a silicon optical chip device.
Inventors:
YIN YANLONG (CN)
CHEN SITAO (CN)
SUI SHAOSHUAI (CN)
ZHAO QISHENG (CN)
CHEN SITAO (CN)
SUI SHAOSHUAI (CN)
ZHAO QISHENG (CN)
Application Number:
PCT/CN2021/117229
Publication Date:
June 02, 2022
Filing Date:
September 08, 2021
Export Citation:
Assignee:
HISENSE BROADBAND MULTIMEDIA TECHNOLOGY CO LTD (CN)
International Classes:
G02B6/42; H04B10/40
Foreign References:
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| US20070081756A1 | 2007-04-12 | |||
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| CN105634611A | 2016-06-01 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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