Title:
OPTICAL-SEMICONDUCTOR-DEVICE-SEALING SHEET
Document Type and Number:
WIPO Patent Application WO/2023/013653
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an optical-semiconductor-device-sealing sheet that is suitable for the manufacture of a mini/micro-LED display element or other self-light-emitting display device in which color cast is reduced while contrast and the anti-reflective functions of a metal wire are improved. This optical-semiconductor-device-sealing sheet 10 comprises a diffusion layer 1 and an anti-reflective layer 2. The diffusion layer 1 is a resin layer, and the anti-reflective layer 2 is a resin layer. The diffusion layer 1 contains light-diffusing fine particles, and the anti-reflective layer 2 contains a colorant.
Inventors:
FUKUTOMI SHUHEI (JP)
TANAKA SHUMPEI (JP)
UENO TAIKI (JP)
ASAI RYOKO (JP)
NAKANO TAKESHI (JP)
TANAKA SHUMPEI (JP)
UENO TAIKI (JP)
ASAI RYOKO (JP)
NAKANO TAKESHI (JP)
Application Number:
PCT/JP2022/029699
Publication Date:
February 09, 2023
Filing Date:
August 02, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L33/54; B32B27/20; B32B27/30; G02B1/11; G02B5/00; G02B5/02; H01L33/56
Foreign References:
| JP2013077811A | 2013-04-25 | |||
| JP2019204905A | 2019-11-28 | |||
| JP2006140362A | 2006-06-01 | |||
| JP2013159004A | 2013-08-19 | |||
| JP2008235705A | 2008-10-02 | |||
| US20200235075A1 | 2020-07-23 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
Download PDF:
Previous Patent: OPTICAL-SEMICONDUCTOR-DEVICE SEALING SHEET
Next Patent: FULL-ELECTRIC CORE DRIVING APPARATUS AND MOLDING MACHINE
Next Patent: FULL-ELECTRIC CORE DRIVING APPARATUS AND MOLDING MACHINE