Title:
OPTICAL SENSOR PACKAGE AND ARRAY APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/243756
Kind Code:
A1
Abstract:
The present invention relates to an optical sensor package and an array apparatus, and comprises: a substrate for receiving light in a target wavelength region, from one side surface thereof, to transmit the light; a light absorption layer which is disposed on the other side surface of the substrate and absorbs the light in the target wavelength region to generate current; and a reflective substrate which is disposed facing the other side surface of the substrate, with a cavity region therebetween, and reflects the light in the target wavelength region, which has transmitted through the substrate and the light absorption layer. Thus, the present invention may be used in high-efficiency optical sensors and image sensors having a light absorption layer with a thin thickness.
Inventors:
JUN DONG HWAN (KR)
KIM JONG MIN (KR)
KIM SHIN KEUN (KR)
KIM JONG MIN (KR)
KIM SHIN KEUN (KR)
Application Number:
PCT/KR2022/009325
Publication Date:
December 21, 2023
Filing Date:
June 29, 2022
Export Citation:
Assignee:
KOREA ADVANCED NANO FAB CENTER (KR)
International Classes:
H01L31/0203; G01J1/42; H01L27/146; H01L31/0232; H01L31/032
Foreign References:
| KR20060034599A | 2006-04-24 | |||
| KR20100135570A | 2010-12-27 | |||
| KR20090012759A | 2009-02-04 | |||
| KR20160021557A | 2016-02-26 | |||
| JP2005003444A | 2005-01-06 |
Attorney, Agent or Firm:
LEE, Joon Sung (KR)
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