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Title:
OPTICAL SIGNAL PROCESSING DEVICE AND MANUFACTURING METHOD FOR OPTICAL SIGNAL PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/138053
Kind Code:
A1
Abstract:
The present invention achieves an optical signal processing device such that, while using a thermally oxidated silica film as undercladding of a silica PLC (planar lightwave circuit), the undercladding can be made thicker and the film formation time during manufacture can be made shorter. This optical signal processing device: is formed as a flat optical circuit that includes an optical waveguide formed on a silicon substrate; and comprises a phase modulation element utilizing thermo-optic effects. The optical signal processing device is characterized in that a plurality of silica films are provided between a core of the optical waveguide and a silicon substrate, and at least one of the plurality of silica films is formed by thermal oxidation.

Inventors:
YAMAGUCHI KEITA (JP)
YANAGIHARA AI (JP)
SUZUKI KENYA (JP)
GO TAKASHI (JP)
MORIWAKI OSAMU (JP)
Application Number:
PCT/JP2019/050556
Publication Date:
July 02, 2020
Filing Date:
December 24, 2019
Export Citation:
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Assignee:
NIPPON TELEGRAPH & TELEPHONE (JP)
International Classes:
G02F1/01
Foreign References:
JPH10104451A1998-04-24
JP2002162526A2002-06-07
JP2001051144A2001-02-23
JP2004085868A2004-03-18
JP2004045453A2004-02-12
US20030040135A12003-02-27
JP2017142423A2017-08-17
Other References:
BAUTERS. J. F. ET AL.: "Planar waveguides with less than 0.1 dB/m propagation loss fabricated with wafer bonding", OPTICS EXPRESS, vol. 19, no. 24, 21 November 2011 (2011-11-21), pages 24090 - 24100, XP055721817
Attorney, Agent or Firm:
TANI & ABE, P.C. (JP)
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