Title:
OPTICAL SYSTEM-IN-PACKAGE, AND OPTICAL MODULE AND OPTICAL TRANSCEIVER USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/182832
Kind Code:
A1
Abstract:
The present invention relates to: an optical system-in-package (O-SIP) in which an edge-emitting light-emitting laser diode and a driver IC are included in the package, a planar light circuit (PLC) chip is assembled directly on a redistribution layer (RDL) or through a main printed circuit board (PCB); and an optical module and an optical transciever, using same. The O-SIP of the present invention comprises: a mold body having planar first and second surfaces on the upper and lower portions; a submount which is molded inside the mold body and has one inclined side; an edge-emitting light-emitting laser diode that is molded inside the mold body, is mounted on the inclined side of the submount, and radiates an optical signal to the first surface; and a redistribution layer that is formed on the first surface of the mold body and is connected to a plurality of external connection terminals for electrically connecting the edge-emitting light-emitting diode to the outside.
Inventors:
CHOI SEONG WOOK (KR)
Application Number:
PCT/KR2023/003868
Publication Date:
September 28, 2023
Filing Date:
March 23, 2023
Export Citation:
Assignee:
LIPAC CO LTD (KR)
International Classes:
H01L23/13; H01L23/498; H01S5/0233
Foreign References:
| US20160223765A1 | 2016-08-04 | |||
| US20150262984A1 | 2015-09-17 | |||
| JP2012137765A | 2012-07-19 | |||
| JP2006196505A | 2006-07-27 | |||
| JP2014164110A | 2014-09-08 | |||
| KR20170055417A | 2017-05-19 |
Attorney, Agent or Firm:
LEE, Jae Hwa (KR)
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