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Title:
OPTOELECTRONIC CONNECTIONS TO PRINTED CIRCUIT BOARDS
Document Type and Number:
WIPO Patent Application WO/2022/174014
Kind Code:
A3
Abstract:
An optoelectronic module and optoelectronic connector assemblies can be used for releasable connection of a laser source to the module from a location exterior to the module. The construction of the optoelectronic connector assemblies is such that both in connection and disconnection, the electrical contacts are broken before the optical contacts so that the laser may power down before the optical connection is broken. The optoelectronic connection assemblies have blind mating features. Some versions are free of any latching or mechanical interconnection of the optoelectronic connector assemblies to each other. A spring has a construction which permits it to be received onto a cable by lateral movement of the spring.

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Inventors:
NINOMIYA TAKUYA (US)
GNIADEK JEFFREY (US)
WONG YIM (CN)
ROYER TYLER (US)
Application Number:
PCT/US2022/016076
Publication Date:
September 22, 2022
Filing Date:
February 11, 2022
Export Citation:
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Assignee:
SENKO ADVANCED COMPONENTS INC (US)
International Classes:
G02B6/04; G02B6/38; G02B6/40
Domestic Patent References:
WO2012017262A12012-02-09
Foreign References:
US4721358A1988-01-26
US20180356601A12018-12-13
US20200183097A12020-06-11
Attorney, Agent or Firm:
LEVITT, Steven N. et al. (US)
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