ORGANIC ELECTRONICS PANEL AND METHOD FOR PRODUCING THE SAME

WIPO Patent Application WO/2010/150648

A1

In an organic electronics panel using a flexible substrate, a method for removing an electrode lead in a small space without deteriorating a sealing property while the conductivity and the adhesion thereof are sufficiently maintained, is provided. Disclosed is an organic electronics panel wherein an organic electronics element configured so that a pair of electrodes are provided on a supporting substrate, and an organic compound layer containing a function layer composed of at least an organic compound is sandwiched by the pair of electrodes, is hermetically sealed by holding the electrodes and the organic compound layer between a sealing member covering the organic electronics element and the supporting substrate. It is characterized in that a joint portion of a pulling portion of each electrode and an electrode lead connected to an outside drive circuit is disposed within an area covered and hermetically sealed by the sealing member, and the electrode lead is removed from the hermetically sealed area.

KOJIMA SHIGERU (JP)
MURAYAMA MASAAKI (JP)
GENDA KAZUO (JP)
NOJIMA TAKAHIKO (JP)

PCT/JP2010/059661

December 29, 2010

June 08, 2010

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KONICA MINOLTA HOLDINGS INC (JP)
KOJIMA SHIGERU (JP)
MURAYAMA MASAAKI (JP)
GENDA KAZUO (JP)
NOJIMA TAKAHIKO (JP)

H05B33/06; H01L31/042; H01L51/42; H01L51/50; H05B33/02; H05B33/04; H05B33/10

JP2002373777A	2002-12-26
JP2007027529A	2007-02-01
JP2006310729A	2006-11-09
JP2001267065A	2001-09-28
JPH11204256A	1999-07-30
JP2004096047A	2004-03-25
JP2007086504A	2007-04-05
JP2008218306A	2008-09-18
JP2002352953A	2002-12-06

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