Title:
ORGANIC INSULATOR, METAL-CLAD LAMINATE AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/004223
Kind Code:
A1
Abstract:
This organic insulator has an organic resin phase as a main component, and a weathering stabilizer is included in the organic resin phase. The organic resin phase includes an inner area and a surface area, which is formed on at least one surface of the inner area, and the content ratio of the weathering stabilizer is higher in the surface area than in the inner area. This metal-clad laminate comprises the organic insulator and metal foil laminated on at least one surface of the organic insulator. This wiring board comprises a plurality of insulating layers, which are configured from the organic insulators, and metal foil positioned between the insulating layers.
Inventors:
NAGASAWA TADASHI (JP)
YOSHIURA SATOSHI (JP)
CHIKARA CHIE (JP)
YOSHIURA SATOSHI (JP)
CHIKARA CHIE (JP)
Application Number:
PCT/JP2018/024230
Publication Date:
January 03, 2019
Filing Date:
June 26, 2018
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01B3/30; B32B27/18; B32B27/30; B32B27/32; C08K5/03; C08L45/00; H01B3/44; H05K1/03
Domestic Patent References:
| WO2013047726A1 | 2013-04-04 | |||
| WO2014050871A1 | 2014-04-03 | |||
| WO2018016527A1 | 2018-01-25 |
Foreign References:
| JP2003238761A | 2003-08-27 | |||
| JP2010123497A | 2010-06-03 | |||
| JPS5660241A | 1981-05-25 | |||
| JP2003110246A | 2003-04-11 | |||
| JP2010100843A | 2010-05-06 |
Other References:
See also references of EP 3648116A4
Attorney, Agent or Firm:
FUKAI, Toshikazu (JP)
Download PDF: