Title:
ORGANIC LAYER POLISHING COMPOSITION AND METHOD FOR POLISHING USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/260433
Kind Code:
A1
Abstract:
The present invention relates to an organic layer polishing composition and a method for polishing using same. The organic layer polishing composition includes a polishing promoter containing both a hydrophilic group and a hydrophobic group so that even for an organic layer that is strongly bound by covalent bonds, such as an amorphous carbon layer (ACL) or diamond-like-carbon (DLC), as well as a polymer, SOC, and SOH, the polishing rate is maintained high.
Inventors:
KIM HEE SUK (KR)
LEE GOO HWA (KR)
YOO JAE HONG (KR)
PARK JONG DAI (KR)
KIM JAE HYUN (KR)
LEE GOO HWA (KR)
YOO JAE HONG (KR)
PARK JONG DAI (KR)
KIM JAE HYUN (KR)
Application Number:
PCT/KR2022/008090
Publication Date:
December 15, 2022
Filing Date:
June 08, 2022
Export Citation:
Assignee:
DONGJIN SEMICHEM CO LTD (KR)
International Classes:
C09K3/14; H01L21/304
Foreign References:
| US7201784B2 | 2007-04-10 | |||
| KR20060071875A | 2006-06-27 | |||
| JP2009533863A | 2009-09-17 | |||
| KR20140013236A | 2014-02-05 | |||
| KR20190039635A | 2019-04-15 |
Attorney, Agent or Firm:
IPCJ PATENT & LAW FIRM (KR)
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