Title:
ORGANIC POLYMER, SEMICONDUCTOR HARD MASK COMPOSITION COMPRISING SAME, AND PATTERNING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/214800
Kind Code:
A1
Abstract:
The present invention relates to an organic polymer having improved etching resistance, solubility, and mechanical properties by comprising a polymer of a specific component, a semiconductor hard mask composition comprising same, and a patterning method using same. The present invention provides a polymer for a semiconductor hard mask comprising a structure represented by chemical formula 1 below. [Chemical Formula 1] (R1 is a hydrocarbon containing one or more benzene ring structures, and n is an integer from 1 to 10000.)
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Inventors:
CHA HYUK JIN (KR)
LEE KEUN JOO (KR)
KIM DEOGBAE (KR)
KIM KEUN SOO (KR)
LEE KEUN JOO (KR)
KIM DEOGBAE (KR)
KIM KEUN SOO (KR)
Application Number:
PCT/KR2023/006050
Publication Date:
November 09, 2023
Filing Date:
May 03, 2023
Export Citation:
Assignee:
HUNET PLUS CO LTD (KR)
International Classes:
C08G61/02; C08K5/3445; C08L61/24; C08L61/28; C08L65/00; H01L21/033
Domestic Patent References:
WO2008120855A1 | 2008-10-09 |
Foreign References:
KR101484568B1 | 2015-01-21 | |||
KR102336257B1 | 2021-12-06 | |||
KR102191919B1 | 2020-12-16 | |||
KR102194297B1 | 2020-12-22 |
Attorney, Agent or Firm:
KWAK, Hyun Kyu (KR)
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