Title:
ORGANIC SILICON RESIN CONDUCTIVE ADHESIVE, AND PREPARATION METHOD THEREFOR AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/142752
Kind Code:
A1
Abstract:
Disclosed in the present invention is an organic silicon resin conductive adhesive, comprising, on the basis of a total of 100 parts by weight, the following components in parts by weight: 40-84 parts of conductive particles, 10-25 parts of an organic silicon resin, 5.5-20 parts of silicone oil, 0.2-3.0 parts of a silane coupling agent, 0.01-1 part of a catalyst, and 0.005-0.05 parts of an inhibitor. The conductive particles are conductive particles having a three-dimensional dendritic microstructure. The present invention further sets forth a preparation method for the organic silicon resin conductive adhesive, and an application in a semiconductor element. According to the present invention, by applying the conductive particles having the three-dimensional dendritic microstructure, contact between the conductive particles is multipoint contact, so that a conductive network is formed, the contact resistance thereof is greatly reduced, and the conductivity is greatly increased; moreover, the conductive adhesive obtained by the present invention has advantages of quick curing and long-term operation and use at room temperature, and the preparation method is simple, the conditions are mild, and the present invention is suitable for industrial production.
Inventors:
XU JINGWEN (CN)
SUN FENGZHEN (CN)
LI DELIN (CN)
SUN FENGZHEN (CN)
LI DELIN (CN)
Application Number:
PCT/CN2020/072639
Publication Date:
July 22, 2021
Filing Date:
January 17, 2020
Export Citation:
Assignee:
SOLTRIUM ADVANCED MATERIALS TECH LTD SHENZHEN (CN)
International Classes:
C09J183/04; H01B1/22
Domestic Patent References:
| WO2016151859A1 | 2016-09-29 | |||
| WO2015184597A1 | 2015-12-10 |
Foreign References:
| CN103400637A | 2013-11-20 | |||
| CN106573303A | 2017-04-19 | |||
| EP3162466A1 | 2017-05-03 | |||
| EP3192597A1 | 2017-07-19 |
Attorney, Agent or Firm:
SHENZHEN HEDAOYINGLIAN PATENT FILM (GENERAL PARTNERSHIP) (CN)
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