ORGANOPOLYSILOXANE COMPOSITION HAVING EXCELLENT BONDING PERFORMANCE AND RELIABILITY AND PREPARATION METHOD THEREFOR

WIPO Patent Application WO/2023/087411

A1

An organopolysiloxane composition having excellent bonding performance and reliability and a preparation method therefor, especially an organopolysiloxane composition suitable for positioning and bonding a heat dissipation cover plate of a semiconductor chip, and a preparation method therefor. Branched hydrogen-containing polysiloxane is used as a cross-linking agent, such that the reaction activity is improved while reinforcement is carried out; a self-made capsule type platinum catalyst is used, such that the occurrence of a reaction is well inhibited at a low temperature, rapid dissociation and release are implemented at a high temperature, and a rapid cross-linking reaction can be carried out; and meanwhile, by means of an effective pre-reaction treatment mode of a bonding promoter and Si-H bond-containing organopolysiloxane, excellent bonding performance and bonding reliability are provided, and an effective method for avoiding the generation of H2 in a long-term storage process is provided at the same time, thereby reducing the bonding failure risk in a long-term use process.

JIANG YUN (CN)
WANG JIANBIN (CN)
CHEN TIANAN (CN)
XU YOUZHI (CN)
XIE HAIHUA (CN)

PCT/CN2021/134963

May 25, 2023

December 02, 2021

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YANTAI DARBOND TECHNOLOGY CO (CN)

C09J183/07; C09J11/06; C09J11/08

CN110382625A	2019-10-25
JP2002322363A	2002-11-08
JP2003041231A	2003-02-13
JP2002020720A	2002-01-23
US20210171771A1	2021-06-10
US20110097579A1	2011-04-28
US20090075009A1	2009-03-19
US6017587A	2000-01-25

YANTAI SHANGHE INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)

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