Title:
ORGANOSILICON-MODIFIED POLYIMIDE RESIN COMPOSITION AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/086963
Kind Code:
A3
Abstract:
An organosilicon-modified polyimide composition, comprising an organosilicon-modified polyimide, a thermal curing agent, a fluorescent powder and heat dissipation particles. The composition has excellent heat resistance, mechanical strength and light transmittance. The organosilicon-modified polyimide resin composition forms a filament base material after coating and drying, and an obtained filament has good flexibility, which enables the filament to be formed in a variety of shapes and achieve 360° omnidirectional light illumination.
Inventors:
SAITO YUKIHIRO (CN)
UNAGI IKE HAYATO (CN)
UNAGI IKE HAYATO (CN)
Application Number:
PCT/IB2018/001560
Publication Date:
July 25, 2019
Filing Date:
September 18, 2018
Export Citation:
Assignee:
JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO LTD (CN)
International Classes:
C08G73/10; C08J5/18; C09J163/00; H01L25/075
Foreign References:
| CN101914357A | 2010-12-15 | |||
| CN105542693A | 2016-05-04 | |||
| CN104231994A | 2014-12-24 | |||
| CN105295792A | 2016-02-03 | |||
| CN101360801A | 2009-02-04 | |||
| US20050107497A1 | 2005-05-19 |
Attorney, Agent or Firm:
CHINA SINDA INTELLECTUAL PROPERTY LTD. (CN)
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