Title:
ORGANOSILICON PRESSURE-SENSITIVE ADHESIVE AND PREPARATION METHOD THEREOF, COMPOSITE FILM STRUCTURE, DIAPHRAGM, AND SOUND GENERATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/237696
Kind Code:
A1
Abstract:
The present invention provides an organosilicon pressure-sensitive adhesive, a preparation method thereof, a composite film structure using the organosilicon pressure-sensitive adhesive, a diaphragm using the composite film structure, and a sound generating device using the diaphragm. The raw materials for preparing the organosilicon pressure-sensitive adhesive include, in parts by weight: 15-60 parts of an organosilicon resin, 5-55 parts of an organosilicon rubber, 30-90 parts of an organic solvent, and 0.1-5 parts of a catalyst. In the present invention, the diaphragm using the organosilicon pressure-sensitive adhesive has improved high-temperature resistance. As a result, polarization will not occur at the diaphragm when vibrating, thereby allowing the sound generating device using the diaphragm to have improved sound quality and audio stability.
Inventors:
WANG HAIFENG (CN)
WANG TING (CN)
LI CHUN (CN)
LIU CHUNFA (CN)
WANG TING (CN)
LI CHUN (CN)
LIU CHUNFA (CN)
Application Number:
PCT/CN2018/121430
Publication Date:
December 19, 2019
Filing Date:
December 17, 2018
Export Citation:
Assignee:
GOERTEK INC (CN)
International Classes:
C09J183/04; C09J7/10; C09J7/30; H04R9/02
Foreign References:
| CN102127389A | 2011-07-20 | |||
| CN101177595A | 2008-05-14 | |||
| CN101560372A | 2009-10-21 | |||
| CN102051154A | 2011-05-11 |
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