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Title:
ORIENTED ELECTROMAGNETIC STEEL SHEET
Document Type and Number:
WIPO Patent Application WO/2019/013348
Kind Code:
A1
Abstract:
This oriented electromagnetic steel sheet is provided with a base material steel sheet, an oxide film formed on the base material steel sheet and formed from amorphous SiO2,and a tension insulating film formed on the oxide film. As chemical components, the base material steel sheet contains, by mass percent, less than or equal to 0.085% C, 0.80-7.00% Si, less than or equal to 1.00% Mn, less than or equal to 0.065% acid soluble Al, and less than or equal to 0.050% of the Seq represented by S+0.406*Se, the remainder consisting of Fe and unavoidable impurities. Regarding the FWHMs, i.e., the half-value widths of the peaks of cristobalite-type aluminum phosphate obtained by X-ray diffraction, (i) the half-value width (FWHM-Co) of the peak appearing at 2θ = 24.8° when using a Co-Kα excitation source is less than or equal to 2.5 degrees, or, (ii) the half-value width (FWHM-Cu) of the peak appearing at 2θ = 21.3° when using a Cu-Kα excitation source is less than or equal to 2.1 degrees.

Inventors:
TAKATANI SHINSUKE (JP)
TAKAHASHI MASARU (JP)
MIZUKAMI KAZUMI (JP)
OKUMURA SHUNSUKE (JP)
NAGANO SHOHJI (JP)
Application Number:
PCT/JP2018/026615
Publication Date:
January 17, 2019
Filing Date:
July 13, 2018
Export Citation:
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Assignee:
NIPPON STEEL & SUMITOMO METAL CORP (JP)
International Classes:
C23C28/04; C22C38/00; C22C38/60; C23C8/14; C23C26/00; H01F1/147
Foreign References:
JP2004506584A2004-03-04
JPH01147074A1989-06-08
JP2017137417A2017-08-10
JPS4839338A1973-06-09
JPH07278670A1995-10-24
JPH11106827A1999-04-20
JPH07118750A1995-05-09
JP2003268450A2003-09-25
JPH07278833A1995-10-24
JP2002322566A2002-11-08
JP2002348643A2002-12-04
JP2003293149A2003-10-15
JP2002363763A2002-12-18
JP2003313644A2003-11-06
Other References:
B. D. CULITYGENTARO MATSUMURA: "Culity: Elements of X-ray Diffraction", 1980, AGNE SHOFU PUBLISHING INC., pages: 94
See also references of EP 3653756A4
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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