ORIGINAL FORM BODY OF FLEXIBLE PRINTED-WIRING BOARD, METHOD OF MANUFACTURING FLEXIBLE PRINTED-WIRING BOARD, CONCENTRATED PHOTOVOLTAIC POWER GENERATION MODULE, AND LIGHT EMITTING MODULE

WIPO Patent Application WO/2020/004144

A1

An original form body of a flexible printed-wiring board which is deployed and disposed on a bottom surface of the housing of a concentrated photovoltaic power generation module for generating power by concentrating sunlight. The original form body is provided with: a narrow strip-shaped flexible substrate extending in the X-direction which is one direction of the original form body; a print circuit portion which includes a plurality of cells mounted on the flexible substrate at regular intervals in the X-direction, and an electric circuit concerning the cells; and a plurality of connecting bands which, in a state in which a plurality of flexible substrates are arranged in proximity to each other in the Y-direction orthogonal to the X-direction, interconnect the plurality of flexible substrates.

JPH02251193	PRINTED WIRING BOARD STRUCTURE
JP4770391	Digital signal processing board
JPS5877299	HEAT SINK SUBSTRATE FOR MOUNTING ELECTRONIC PART

SAITO KENJI (JP)
KOIKE YUKIO (JP)
NAGAI YOUICHI (JP)
TOYA KAZUMASA (JP)

PCT/JP2019/024095

January 02, 2020

June 18, 2019

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SUMITOMO ELECTRIC INDUSTRIES (JP)

H05K1/02; H01L31/054; H02S40/22

JP2017126777A	2017-07-20
JPH0685409A	1994-03-25
JP2014035502A	2014-02-24
JP2016096309A	2016-05-26
JP2015170699A	2015-09-28
JP2018121660A	2018-08-09
JP2016018991A	2016-02-01
JP2017126777A	2017-07-20

See also references of EP 3817519A4

SUNCREST PATENT AND TRADEMARK ATTORNEYS (JP)

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