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Patent Searching and Data


Title:
OUTER PANEL
Document Type and Number:
WIPO Patent Application WO/2023/224023
Kind Code:
A1
Abstract:
This outer panel has, on the outer surface thereof, a ridgeline and plane sections adjacent to each side of the ridgeline. The outer panel has a plate thickness of less than 0.6 mm and an ultimate yield stress of 360 MPa or more. The plane sections each include: an adjacent section which is adjacent to the ridgeline; and a separated region which is adjacent to the adjacent section on the side opposite the ridgeline. The results of evaluating surface characteristics are consistent between the adjacent region and the separated region.

Inventors:
SAWA YASUNORI (JP)
NISHIMURA RYUICHI (JP)
Application Number:
PCT/JP2023/018223
Publication Date:
November 23, 2023
Filing Date:
May 16, 2023
Export Citation:
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Assignee:
NIPPON STEEL CORP (JP)
International Classes:
B60J5/04; B62D25/00
Domestic Patent References:
WO2018021422A12018-02-01
WO2019146789A12019-08-01
WO2011122492A12011-10-06
Foreign References:
JP2011218979A2011-11-04
JP2010280127A2010-12-16
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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