Title:
PRECIPITATION HARDENING-TYPE Ag-Pd-Cu-In-B-BASED ALLOY
Document Type and Number:
WIPO Patent Application WO/2019/130511
Kind Code:
A1
Abstract:
Provided is an alloy with superior overall balance and a higher hardness than before, and which exhibits good contact resistance stability (oxidation resistance) and plastic workability while maintaining a low level of resistivity comparable at least with that of a conventional Ag-Pd-Cu alloy. This precipitation hardening-type alloy comprises 17-23.6 at% of Ag, 0.5-1.1 at% of B, and a total of 74.9-81.5 at% of Pd and Cu, wherein the atomic percentage ratio between the Pd and the Cu is 1:1 to 1:1.2 and the balance comprises In and incidental impurities.
Inventors:
SHISHINO RYUU (JP)
Application Number:
PCT/JP2017/047072
Publication Date:
July 04, 2019
Filing Date:
December 27, 2017
Export Citation:
Assignee:
TOKURIKI HONTEN KK (JP)
International Classes:
C22C5/04; C22C30/02; G01R1/067
Domestic Patent References:
| WO2013099682A1 | 2013-07-04 |
Foreign References:
| JP2017025354A | 2017-02-02 | |||
| JP2011122194A | 2011-06-23 | |||
| JP2012242184A | 2012-12-10 | |||
| US20170218481A1 | 2017-08-03 | |||
| JP2001518980A | 2001-10-16 |
Attorney, Agent or Firm:
KANAKURA Kyoji (JP)
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