PACKAGE FOR ACCOMMODATING ELECTRONIC PART, AND ELECTRONIC DEVICE

WIPO Patent Application WO/2014/046133

A1

[Problem] To provide a package for accommodating an electronic part, the package having high mounting reliability, and to provide an electronic device. [Solution] This package (1) for accommodating an electronic part is provided with: an insulating substrate (2) having one main surface (2a), another main surface (2b), a first recessed section (3) for accommodating an electronic part, the first recessed section (3) being provided to the one main surface (2a), and a second recessed section (4) for accommodating another electronic part, the second recessed section (4) being provided to the other main surface (2b). The insulating substrate (2) comprises a plurality of insulating layers (5) and has a protruding section (6) that protrudes from the side wall surface (4a) of the second recessed section (4). The side wall surface (4a) of the second recessed section (4) is positioned outward of the side wall surface (3a) of the first recessed section (3), as viewed in longitudinal section. The protruding section (6) has the same height as the side wall surface (4a) of the second recessed section (4).

NAKASHIMA SHUZOU (JP)
MORIYAMA YOUSUKE (JP)
IIYAMA MASATSUGU (JP)
HORIUCHI KANAE (JP)

PCT/JP2013/075162

March 27, 2014

September 18, 2013

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KYOCERA CORP (JP)

H01L23/08; H01L23/02; H01L23/12

WO2000033455A1

2000-06-08

JP2007184807A	2007-07-19
JP2009124619A	2009-06-04
JPH07273448A	1995-10-20
JP2010067729A	2010-03-25
JPH10335823A	1998-12-18

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