Title:
PACKAGE STRUCTURE, ELECTRONIC DEVICE, AND PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/207972
Kind Code:
A1
Abstract:
The present application discloses a package structure, an electronic device, and a packaging method. The package structure comprises: a carrier plate; multiple package bodies, the multiple package bodies being successively stacked on a first surface of the carrier plate; wires, each of the package bodies being electrically connected to the first surface of the carrier plate by means of the wire; and a first package layer, the first package layer covering the carrier plate and the multiple package bodies.
Inventors:
YANG WANGLAI (CN)
Application Number:
PCT/CN2023/090576
Publication Date:
November 02, 2023
Filing Date:
April 25, 2023
Export Citation:
Assignee:
VIVO MOBILE COMMUNICATION CO LTD (CN)
International Classes:
H01L21/60; H01L23/49; H01L25/00
Foreign References:
| CN114843238A | 2022-08-02 | |||
| TW200818457A | 2008-04-16 | |||
| CN105845643A | 2016-08-10 | |||
| CN109427759A | 2019-03-05 | |||
| CN109148431A | 2019-01-04 | |||
| CN107452720A | 2017-12-08 | |||
| US20120032314A1 | 2012-02-09 |
Attorney, Agent or Firm:
CN-KNOWHOW INTELLECTUAL PROPERTY AGENT LIMITED (CN)
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