Title:
PACKAGE STRUCTURE FACILITATING SYSTEM HEAT DISSIPATION, AND PACKAGING PROCESS THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/114410
Kind Code:
A1
Abstract:
A package structure facilitating system heat dissipation comprises: a substrate (1); an active chip (2) mounted on the substrate (1); a memory chip (3) mounted on the active chip (2); a heat conductor (4), wherein the heat conductor (4) and the memory chip (3) are mounted on the same surface of the active chip (2), and the heat conductor (4) is provided with a second TSV connected to the active chip (2); and a package body (5) for packaging the active chip (2), the memory chip (3), and the heat conductor (4) on the substrate (1), wherein one end of the second TSV of the heat conductor (4) is connected to the active chip (2), and the other end of the second TSV is exposed on a surface of the package body (5). The package structure has an expanded heat dissipation path, thereby significantly improving the heat dissipation performance. The present invention further relates to a packaging process of the package structure.
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| WO/2022/164317 | INTEGRATED CIRCUIT |
Inventors:
SUN PENG (CN)
XU CHENG (CN)
REN YULONG (CN)
CAO LIQIANG (CN)
XU CHENG (CN)
REN YULONG (CN)
CAO LIQIANG (CN)
Application Number:
PCT/CN2019/128945
Publication Date:
June 17, 2021
Filing Date:
December 27, 2019
Export Citation:
Assignee:
SHANGHAI XIANFANG SEMICONDUCTOR CO LTD (CN)
NAT CENTER FOR ADVANCED PACKAGING CO LTD (CN)
NAT CENTER FOR ADVANCED PACKAGING CO LTD (CN)
International Classes:
H01L23/367; H01L23/31; H01L23/48
Foreign References:
| CN102194804A | 2011-09-21 | |||
| CN103782381A | 2014-05-07 | |||
| CN210607230U | 2020-05-22 | |||
| US20170358552A1 | 2017-12-14 |
Attorney, Agent or Firm:
SUNSHINE INTELLECTUAL PROPERTY INTERNATIONAL CO., LTD. (CN)
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