Title:
PACKAGE STRUCTURE, MANUFACTURING METHOD THEREFOR, AND COMMUNICATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/226799
Kind Code:
A1
Abstract:
The present application discloses a package structure, a manufacturing method therefor, and a communication apparatus, which can achieve low-cost packaging while meeting the high heat dissipation requirements and high stress relief requirements of power devices. The package structure comprises a substrate, a power device, a lead frame, and a package cover plate. The substrate is a metal alloy substrate having a coefficient of thermal expansion (CTE) of 6-24 ppm/℃. The lead frame is disposed on a first surface of the substrate and comprises a frame body and pins. An accommodation chamber used to accommodate the power device is formed between the frame body and the substrate. The pins are embedded on the frame body, and each pin has a first end exposed inside the accommodation chamber and a second end exposed outside the accommodation chamber. The power device is disposed on the first surface of the substrate and located in the accommodation chamber, and is electrically connected to the first ends of the pins. The package cover plate is fixed at a surface of the frame body facing away from the substrate.
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Inventors:
LUO WEI (CN)
XU XIAO (CN)
WANG QINGFENG (CN)
CHEN TEWEI (CN)
XU XIAO (CN)
WANG QINGFENG (CN)
CHEN TEWEI (CN)
Application Number:
PCT/CN2020/089650
Publication Date:
November 18, 2021
Filing Date:
May 11, 2020
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/29
Foreign References:
| JPH05198701A | 1993-08-06 | |||
| US5821628A | 1998-10-13 | |||
| CN1215501A | 1999-04-28 | |||
| CN1355564A | 2002-06-26 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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