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Title:
PACKAGE STRUCTURE FOR REDUCING QUANTUM DOT DECAY, AND METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/257129
Kind Code:
A1
Abstract:
A package structure (100) for reducing quantum dot decay, comprising: a light-emitting layer (110) further comprising at least one substrate (111) and a light-emitting wafer (112), wherein the light-emitting wafer (112) is disposed on the substrate (111) and is electrically connected to the substrate (111); a first protective layer (120) located on the light-emitting wafer (112); a quantum dot layer (130) located on the first protective layer (120); and a second protective layer (140) located on the quantum dot layer (130).

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Inventors:
LIN LICHEN (CN)
Application Number:
PCT/CN2021/099810
Publication Date:
December 15, 2022
Filing Date:
June 11, 2021
Export Citation:
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Assignee:
JIANGSU NEW CLOUD CHINA PHOTOELECTRIC TECH CO LTD (CN)
International Classes:
H01L51/50; H01L33/48; H01L33/50
Foreign References:
CN208298873U2018-12-28
CN111192947A2020-05-22
CN109755357A2019-05-14
CN108735879A2018-11-02
CN109004071A2018-12-14
KR20200020141A2020-02-26
Attorney, Agent or Firm:
HUAHE IP LIMITED (CN)
Download PDF:
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