Title:
PACKAGE STRUCTURE OF SEMICONDUCTOR LIGHT-EMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2006/128375
Kind Code:
A1
Abstract:
A package structure of semiconductor light-emitting device comprises a substrate, a sub-mount, a semiconductor light-emitting die and a package material. The substrate defines a top surface and a bottom surface. The first concave part is formed in the top surface of the substrate, and the second concave part is formed in the bottom surface of the substrate. The first concave part penetrates through the second concave part and contacts with the second concave part. A protruding part is formed along the edge of the first concave part on the top surface. The sub-mount embeds into the second concave part. The sub-mount defines a first surface, and at least one semiconductor light-emitting die is fixed on the first surface. The package material is used to fill the inner of the protruding part.
Inventors:
CHEN JEN-SHYAN (CN)
Application Number:
PCT/CN2006/001165
Publication Date:
December 07, 2006
Filing Date:
May 31, 2006
Export Citation:
Assignee:
CHEN JEN-SHYAN (CN)
International Classes:
H01L33/44; H01L33/54; H01L33/56; H01L33/60; H01L33/62; H01L33/64; H01S5/00
Foreign References:
| TWM261835U | 2005-04-11 | |||
| CN1436374A | 2003-08-13 | |||
| CN1466782A | 2004-01-07 | |||
| CN2612075Y | 2004-04-14 | |||
| JP2004260048A | 2004-09-16 | |||
| US6835960B2 | 2004-12-28 |
Other References:
See also references of EP 1898473A4
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (Huibin Building No. 8, Beichen Dong Stree, Chaoyang District Beijing 1, CN)
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