Title:
PACKAGE SUBSTRATE HAVING MICRO-STRUCTURED CHAMBER AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/041095
Kind Code:
A1
Abstract:
The present application relates to the technical field of package substrate manufacturing, and in particular to a package substrate having a micro-structured chamber and a manufacturing method therefor. The manufacturing method for the package substrate having a micro-structured chamber comprises: providing a base material plate having a first metal layer; forming a second metal layer on the first metal layer by electroplating, wherein the second metal layer comprises a plurality of column structures distributed at intervals and a frame structure surrounding the peripheries of the plurality of column structures, and phase-change medium injection ports are formed on the frame structure; forming a metal cover plate on the second metal layer, such that the metal cover plate, the frame structure and the first metal layer jointly form a chamber; and pouring a phase-change medium into the chamber through the phase-change medium injection ports, and sealing the chamber. According to the manufacturing method for the package substrate having a micro-structured chamber of the present application, the thermal resistance in transfer of heat of a power device to a heat dissipation device can be effectively reduced, so that power devices having higher power density can be packaged per unit volume.
Inventors:
WANG RUIXUN (CN)
WANG YUHE (CN)
WANG YUHE (CN)
Application Number:
PCT/CN2023/098932
Publication Date:
February 29, 2024
Filing Date:
June 07, 2023
Export Citation:
Assignee:
ELECTRONIC MATERIAL TECH COMPANY LIMITED (CN)
International Classes:
H01L21/48; H01L23/367; H01L23/373; H01L23/427; H01L23/498
Domestic Patent References:
| WO2021102686A1 | 2021-06-03 |
Foreign References:
| CN115346880A | 2022-11-15 | |||
| CN115360099A | 2022-11-18 | |||
| CN113451241A | 2021-09-28 | |||
| US20210057354A1 | 2021-02-25 |
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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