Title:
PACKAGE WITH BUILT-IN THERMOELECTRIC ELEMENT
Document Type and Number:
WIPO Patent Application WO/2018/151176
Kind Code:
A1
Abstract:
A package with a built-in thermoelectric element according to one embodiment of the present disclosure is provided with a thermoelectric conversion module which comprises a first substrate having first and second main surfaces, a second substrate having third and fourth main surfaces, and a plurality of thermoelectric elements that are sandwiched between the first substrate and the second substrate and are arranged along the second main surface and the third main surface. This package with a built-in thermoelectric element is also provided with: a frame body which is bonded to the first and second substrates so as to form an airtight space that surrounds the plurality of thermoelectric elements between the first and second substrates; and an arrangement part which is arranged on the first main surface of the first substrate or the fourth main surface of the second substrate, and to which another device is connected. The first substrate is provided with: an inner conductor pattern which is arranged on the second main surface and is connected to a thermoelectric element; an outer conductor pattern which is arranged on the first main surface and is exposed to the outside; a buried conductor pattern which is buried within the substrate and is connected to the outer conductor pattern; and a first via conductor which penetrates through the space between the inner conductor pattern and the buried conductor pattern, thereby electrically connecting the inner conductor pattern and the buried conductor pattern to each other.
Inventors:
OGAWA MASAHIRO (JP)
KATO TETSUYA (JP)
HACHIDA TAKAYUKI (JP)
KATO TETSUYA (JP)
HACHIDA TAKAYUKI (JP)
Application Number:
PCT/JP2018/005139
Publication Date:
August 23, 2018
Filing Date:
February 14, 2018
Export Citation:
Assignee:
NGK SPARK PLUG CO (JP)
FERROTEC HOLDINGS CORP (JP)
FERROTEC HOLDINGS CORP (JP)
International Classes:
H01L35/02; H01L23/36; H01L23/38; H01L35/32
Foreign References:
| JP2007110082A | 2007-04-26 | |||
| JPH1090077A | 1998-04-10 | |||
| JP2005064457A | 2005-03-10 | |||
| JP2004303750A | 2004-10-28 |
Attorney, Agent or Firm:
NAGOYA INTERNATIONAL PATENT FIRM (JP)
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