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Title:
PACKAGING ADHESIVE FILM FOR PHOTOVOLTAIC MODULE, PACKAGING ADHESIVE FILM PREPARATION METHOD, AND PHOTOVOLTAIC MODULE
Document Type and Number:
WIPO Patent Application WO/2024/002274
Kind Code:
A1
Abstract:
The invention belongs to the technical field of photovoltaic modules, and specifically relates to a packaging adhesive film for a photovoltaic module, a packaging adhesive film preparation method, and a photovoltaic module. The packaging adhesive film comprises the following components in parts by weight: 100 parts of EVA resin, 20-50 parts of transparent flame-retardant masterbatch, 5-20 parts of toughening compatible resin and 0.9-7 parts of an auxiliary agent; wherein the transparent flame-retardant masterbatch comprises the following components in parts by weight: 100 parts of EVA resin, 20-30 parts of a liquid flame retardant, 5-20 parts of a powder flame retardant, 1 part of a dispersing agent and 1-20 parts of a plasticizer. The packaging adhesive film for a photovoltaic module, the packaging adhesive film preparation method and the photovoltaic module of the present application have an excellent flame-retardant effect, a transparent appearance, high light transmittance, and excellent bonding performance and mechanical properties; moreover, the preparation method involves simple operations, the adhesive film has high production stability, and preparation costs are low.

Inventors:
CHEN LEI (CN)
ZHANG HAOBIN (CN)
JI WENGEN (CN)
Application Number:
PCT/CN2023/104085
Publication Date:
January 04, 2024
Filing Date:
June 29, 2023
Export Citation:
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Assignee:
JIANGSU LUSHAN NEW MAT CO LTD (CN)
International Classes:
C09J7/10; C09J7/30; C09J11/04; C09J11/06; C09J11/08; C09J123/08; H01L31/048
Foreign References:
CN114806425A2022-07-29
CN113563829A2021-10-29
CN112898912A2021-06-04
CN104530548A2015-04-22
CN106432871A2017-02-22
CN102304331A2012-01-04
CN110283540A2019-09-27
CN112980353A2021-06-18
CN113322013A2021-08-31
JP2017025244A2017-02-02
KR100873576B12008-12-12
US20200216647A12020-07-09
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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