Title:
PACKAGING ASSEMBLY AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/164497
Kind Code:
A1
Abstract:
Embodiments of the present application provide a packaging assembly and an electronic device. The packaging assembly comprises: a substrate, a packaged device, a support, and a cover plate. The substrate comprises a first surface and a second surface that are opposite to each other, and side surfaces connecting the first surface to the second surface. The packaged device is located on the first surface of the substrate. The support is located on the first surface of the substrate and surrounds the packaged device. The first surface of the substrate, the cover plate, and the support form a closed space, and the packaged device is accommodated in the closed space. The second surface of the substrate is provided with a grounding pad. The cover plate comprises: a first area, the surface of the support contacting the outside, and the side surfaces of the substrate, wherein an electromagnetic shielding layer is provided on the first area, and the electromagnetic shielding layer of the first area is electrically connected to the grounding pad by means of the support and an electromagnetic shielding layer on the substrate.
Inventors:
GUO XUEPING (CN)
WU PENG (CN)
WU PENG (CN)
Application Number:
PCT/CN2020/074793
Publication Date:
August 20, 2020
Filing Date:
February 12, 2020
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K9/00
Domestic Patent References:
| WO2018143437A1 | 2018-08-09 |
Foreign References:
| CN109890188A | 2019-06-14 | |||
| CN105321933A | 2016-02-10 | |||
| CN105321933A | 2016-02-10 | |||
| CN101442062A | 2009-05-27 | |||
| GB2539191A | 2016-12-14 |
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