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Title:
PACKAGING BAG MATERIAL FOR HARDENABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2003/101859
Kind Code:
A1
Abstract:
A packaging bag material having a structure obtained by laminating of a sealant layer (1) constituted of a synthetic resin layer having an inside surface capable of heat sealing and a barrier layer (3) including a metal thin-film layer (7) with an extruded polyethylene layer (2) interposed therebetween. A synthetic resin layer (6) that is detachable from the polyethylene layer is disposed at an interface between the extruded polyethylene layer and at least one of the sealant layer and the barrier layer. Preferably, the metal thin-film layer is an aluminum foil or aluminum vapor deposition layer. The packaging bag material of this structure is especially suitable for use as a packaging bag material for hardenable compositions, such as resist inks, adhesives, paints, printing inks and the like.

Inventors:
KAKINUMA MASAHISA (JP)
USHIKI SHIGERU (JP)
KOJIMA HIDEAKI (JP)
FUSEGAWA KUNIAKI (JP)
SASAKI AKIRA (JP)
MURATA MINORU (JP)
SOMEYA TAKAFUMI (JP)
Application Number:
PCT/JP2003/007035
Publication Date:
December 11, 2003
Filing Date:
June 03, 2003
Export Citation:
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Assignee:
TAIYO INK MFG CO LTD (JP)
FUJIMORI KOGYO CO (JP)
KAKINUMA MASAHISA (JP)
USHIKI SHIGERU (JP)
KOJIMA HIDEAKI (JP)
FUSEGAWA KUNIAKI (JP)
SASAKI AKIRA (JP)
MURATA MINORU (JP)
SOMEYA TAKAFUMI (JP)
International Classes:
B32B27/08; B65D30/08; (IPC1-7): B65D65/40; B32B7/06; B32B15/08; B65D30/02
Domestic Patent References:
WO2000009174A12000-02-24
Foreign References:
JPS5845081Y21983-10-13
JPH0517235Y21993-05-10
JPS6229231Y21987-07-27
JP2002120858A2002-04-23
JPH0680162A1994-03-22
JP3030325B22000-04-10
JPH0440907Y21992-09-25
JPS6366221U1988-05-02
Attorney, Agent or Firm:
Yoshida, Shigeki (Harada Bldg. 14-2, Takadanobaba 2-chom, Shinjuku-ku Tokyo, JP)
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