Title:
PACKAGING BAG AND PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/034532
Kind Code:
A1
Abstract:
Provided is a packaging bag composed of one or more laminates 10 and having a housing part, wherein: the laminates 10 each have a sealant layer 15, an adhesive layer 14, an electrostatic ink layer 13, a primer layer 23, and a base material 11 in this order from the housing part side; the adhesive layer 14 contains an adhesive composition containing a polyol, a polyisocyanate, and an epoxy compound, a cured product thereof, or a mixture thereof; and the ratio of the thickness of the adhesive layer 14 to the thickness of the electrostatic ink layer 13 is 0.15-5.
Inventors:
YAMAGUCHI KEISUKE (JP)
OKADA KAZUYOSHI (JP)
HORIUCHI MASAFUMI (JP)
OKADA KAZUYOSHI (JP)
HORIUCHI MASAFUMI (JP)
Application Number:
PCT/JP2023/028535
Publication Date:
February 15, 2024
Filing Date:
August 04, 2023
Export Citation:
Assignee:
TOPPAN HOLDINGS INC (JP)
International Classes:
B65D81/34; B32B27/00; B32B27/38; B32B27/40; B65D65/40
Domestic Patent References:
| WO2021024981A1 | 2021-02-11 |
Foreign References:
| JP2021004049A | 2021-01-14 | |||
| JP2011073717A | 2011-04-14 | |||
| JP2018530478A | 2018-10-18 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: