Title:
PACKAGING MATERIAL AND CONTAINER
Document Type and Number:
WIPO Patent Application WO/2023/277037
Kind Code:
A1
Abstract:
A packaging material according to one aspect of the present discourse has a multilayer structure that sequentially comprises a paper base material, an adhesive resin layer, a gas barrier layer and a sealant layer in this order. With respect to this packaging material, the sealant layer contains an ethylene-methacrylic acid copolymer; and the melt flow rate of the sealant layer is from 3.0 g/10 minutes to 40 g/10 minutes as determined at a temperature of 190°C under a load of 2.16 Kg.
Inventors:
IMAIZUMI SHUKIKO (JP)
Application Number:
PCT/JP2022/025832
Publication Date:
January 05, 2023
Filing Date:
June 28, 2022
Export Citation:
Assignee:
TOPPAN INC (JP)
International Classes:
B65D65/40; B65D5/40; B65D5/74
Domestic Patent References:
| WO2021006172A1 | 2021-01-14 |
Foreign References:
| JP2020158154A | 2020-10-01 | |||
| JP2014133568A | 2014-07-24 | |||
| JP2001171649A | 2001-06-26 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF:
Previous Patent: COMPOSITION, AND METHOD FOR PRODUCING SAME
Next Patent: ADJUSTING METHOD AND ADJUSTING DEVICE
Next Patent: ADJUSTING METHOD AND ADJUSTING DEVICE