Title:
PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/224834
Kind Code:
A1
Abstract:
The present invention comprises: a sheet 20 on which an accommodation target part 21 for constituting an accommodation part 42 is provided; and a wiring pattern 30 provided on the sheet 20. The wiring pattern 30 is provided along peripheral edges of the accommodation target part 21 such that a terminal of the wiring pattern 30 is disposed on one side along one direction, and the wiring pattern 30 is arranged along the other three peripheral edges of the accommodation part 42 except the peripheral edge on said one side when the accommodation part 42 is constituted. It is preferable that the sheet 20 be transparent or semi-transparent, an adhesion target part 24 be provided around the accommodation target part 21, and the wiring pattern 30 be arranged on the adhesion target part 24 and on the three peripheral edges of the accommodation target part 21.
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Inventors:
TAKEDA TOMOKI (JP)
MAEDA TOMOHIRO (JP)
KATO HISAYA (JP)
MAEDA TOMOHIRO (JP)
KATO HISAYA (JP)
Application Number:
PCT/JP2022/017244
Publication Date:
October 27, 2022
Filing Date:
April 07, 2022
Export Citation:
Assignee:
UACJ CORP (JP)
UACJ FOIL CORP (JP)
UACJ FOIL CORP (JP)
International Classes:
A61J1/03; A61J7/00; B65D77/20
Domestic Patent References:
| WO2020003105A1 | 2020-01-02 |
Foreign References:
| JPH08301301A | 1996-11-19 | |||
| JP2013166590A | 2013-08-29 | |||
| JPH02257960A | 1990-10-18 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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