Title:
PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/134094
Kind Code:
A1
Abstract:
Disclosed in the present disclosure is a packaging material, comprising: a metal layer; a first resin layer, arranged above the metal layer and comprising a first component; and a second resin layer, arranged on the first resin layer and comprising a second component, wherein the crystallinity of the first component is 10%-30%, the weight-average molecular weight of the first component is 150,000-220,000, the crystallinity of the second component is below 10%, and the weight-average molecular weight of the second component is 220,000-260,000.
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Inventors:
ZHUANG ZHI (CN)
CAO RUIDIAN (CN)
CAI YUHONG (CN)
YE CHENGLIANG (CN)
CHENG YUE (CN)
CAO RUIDIAN (CN)
CAI YUHONG (CN)
YE CHENGLIANG (CN)
CHENG YUE (CN)
Application Number:
PCT/CN2022/092577
Publication Date:
July 20, 2023
Filing Date:
May 13, 2022
Export Citation:
Assignee:
JIANGSU RUIERGY NEW MATERIAL TECH COMPANY LTD (CN)
International Classes:
B32B27/32; B32B15/04; B32B15/20; B32B27/06; B32B27/08; B32B27/30; B32B33/00; B65D65/40; C08J5/18; C08L23/00; C08L23/06; C08L23/12; C08L23/20; H01M50/119; H01M50/121; H01M50/129
Foreign References:
| CN105895833A | 2016-08-24 | |||
| CN106042566A | 2016-10-26 | |||
| JP2017107861A | 2017-06-15 | |||
| JP2015050075A | 2015-03-16 |
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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