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Patent Searching and Data


Title:
PACKAGING MEMBER AND MANUFACTURING METHOD THEREFOR, BACKLIGHT SOURCE ASSEMBLY, AND DISPLAY APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/208138
Kind Code:
A9
Abstract:
A packaging member and a manufacturing method therefor, a backlight source assembly, and a display apparatus. The packaging member comprises a cup-shaped support (1), a light-emitting chip (2), and a packaging glue (3) mixed with a photoluminescent material (4); the light-emitting chip (2) is fixed at the bottom of the support (1) and emits light towards an opening of the support (1); the packaging glue (3) covers the light-emitting chip (2); and the packaging member comprises a light scattering structure, and the light scattering structure is configured to scatter light.

Inventors:
WANG BONING (CN)
WU HAO (CN)
REN JIAN (CN)
ZHENG YANGLI (CN)
MEN NAIQI (CN)
ZHANG XIAOPING (CN)
Application Number:
PCT/CN2023/091312
Publication Date:
May 16, 2024
Filing Date:
April 27, 2023
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE DISPLAY TECH CO (CN)
International Classes:
H01L33/58; G02F1/13357; H01L33/00; H01L33/60
Attorney, Agent or Firm:
AFD CHINA INTELLECTUAL PROPERTY LAW OFFICE (CN)
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