Title:
PACKAGING MEMBER AND MANUFACTURING METHOD THEREFOR, BACKLIGHT SOURCE ASSEMBLY, AND DISPLAY APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/208138
Kind Code:
A9
Abstract:
A packaging member and a manufacturing method therefor, a backlight source assembly, and a display apparatus. The packaging member comprises a cup-shaped support (1), a light-emitting chip (2), and a packaging glue (3) mixed with a photoluminescent material (4); the light-emitting chip (2) is fixed at the bottom of the support (1) and emits light towards an opening of the support (1); the packaging glue (3) covers the light-emitting chip (2); and the packaging member comprises a light scattering structure, and the light scattering structure is configured to scatter light.
Inventors:
WANG BONING (CN)
WU HAO (CN)
REN JIAN (CN)
ZHENG YANGLI (CN)
MEN NAIQI (CN)
ZHANG XIAOPING (CN)
WU HAO (CN)
REN JIAN (CN)
ZHENG YANGLI (CN)
MEN NAIQI (CN)
ZHANG XIAOPING (CN)
Application Number:
PCT/CN2023/091312
Publication Date:
May 16, 2024
Filing Date:
April 27, 2023
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE DISPLAY TECH CO (CN)
BEIJING BOE DISPLAY TECH CO (CN)
International Classes:
H01L33/58; G02F1/13357; H01L33/00; H01L33/60
Attorney, Agent or Firm:
AFD CHINA INTELLECTUAL PROPERTY LAW OFFICE (CN)
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