Title:
PACKAGING STRUCTURE, DISPLAY DEVICE AND PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/252943
Kind Code:
A1
Abstract:
A packaging structure (100), a display device and a packaging method. The packaging structure (100) comprises: a first substrate (10) comprising an effective display region (60); a second substrate (20) disposed opposite to the first substrate (10); a first bonding layer (30) disposed on the first substrate (10) to combine the first substrate (10) and the second substrate (20) with each other; and a water-absorbing layer (50) disposed on the surface of the first bonding layer (30) facing away from the first substrate (10) and located outside the effective display region (60). The packaging structure (100) not only has a relatively long packaging life, but also meets the requirements of top emission for transmittance.
Inventors:
YANG ZHONGGUO (CN)
LI JINCHUAN (CN)
LI JINCHUAN (CN)
Application Number:
PCT/CN2019/105064
Publication Date:
December 24, 2020
Filing Date:
September 10, 2019
Export Citation:
Assignee:
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
H01L51/52; H01L51/56
Foreign References:
| CN110176549A | 2019-08-27 | |||
| CN109888121A | 2019-06-14 | |||
| CN109755408A | 2019-05-14 | |||
| US20170327608A1 | 2017-11-16 |
Attorney, Agent or Firm:
ESSEN PATENT & TRADEMARK AGENCY (CN)
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